The potential for chiplet technology to be a transformational paradigm is now widely recognized. The cost, time-to-market, and power consumption benefits of chiplet-based solutions are compelling the industry toward integrating multiple dies in a single package.
AI has emerged as a primary catalyst for this trend. Custom silicon designed for AI benefits significantly from the chiplet approach, which combines dense logic and memory with the need for high-speed connectivity. The push for custom AI hardware is rapidly evolving, with a focus on energy-efficient designs. Chiplets offer the flexibility to create systems-in-package that balance cost, power, and performance for specific workloads without starting from scratch. AI's unique needs for inter-die communication make reducing latency crucial, and the rollout of larger clusters emphasizes the role of high-speed, optical interconnects.
The application of chiplets extends beyond AI, with growing use in high-performance computing (HPC), next-generation 6G communication, and data center networking. Finding connectivity solutions that satisfy the requirements of these varied applications is essential to fulfilling the potential of chiplets and opening new avenues for innovation across the industry.
Tony Chan Carusone
Tony Chan Carusone was appointed Chief Technology Officer in January 2022. Tony has been a professor of Electrical and Computer Engineering at the University of Toronto since 2001. He has well over 100 publications, including 8 award-winning best papers, focused on integrated circuits for digital communication. Tony has served as a Distinguished Lecturer for the IEEE Solid-State Circuits Society and on the Technical Program Committees of world’s leading circuits conferences. He co-authored the classic textbooks “Analog Integrated Circuit Design” and “Microelectronic Circuits” and he is a Fellow of the IEEE. Tony has also been a consultant to the semiconductor industry for over 20 years, working with both startups and some of the largest technology companies in the world.
Tony holds a B.A.Sc. in Engineering Science and a Ph.D. in Electrical Engineering from the University of Toronto.